Product Description
The AXVU13P FPGA development board equipped with the AMD/Xilinx Virtex Ultrascale+ series device, This board integrates three FMC+connectors,Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio) Provided users with a fully functional testing and verification platform
Provide high-speed communication ( PCIe ) and high-speed storage (SODIMM).
Applications
● Computational acceleration
● Test and Measurement
● Machine Learning and AI
● Emulation and Prototyping
● Network Acceleration
● Wired Communications
● 5G Baseband
● Radar
Key Features
- ● AMD/Xilinx Virtex Ultrascale+ :
◆ 16nm FinFET FPGA fabric
◆ Integrated 100G Ethernet MAC and150G Interlaken cores
◆ More than 2x faster system-level performance per watt compared to Kintex 7 FPGAs
● 1 x DDR4 SODIMM Card slot ( Supports up to 16GB DDR4 )
● 2 x 128 MB QSPI Flash
● 1 x PCIe® Gen3 ×16 - ● 3 x FMC+
● 2 x SMA
● 1 x UART(USB to UART)
● 1 x JTAG
● 8 x LED
● 1 x KEY
● 12V single supply
● Dimensions: 251 x 111.15 mm form factor
Board Features
Featuring the AMD/Xilinx Virtex Ultrascale+ XCVU13P-2FHGB2104
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Kintex Ultrascale+ based application.
What's Inside the Box
ALINX AMD Xilinx Virtex Ultrascale+ XCVU13P FPGA development board and Some accessories
The FAN8060 Heatsink Kit is an optimal cooling solution for FPGA devices – it is low-profile and covers the whole XCVU13P device surface.
