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Alinx Electronic Limited

AXVU13F V1.0 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P

The AXVU13F FPGA development board equipped with the AMD/Xilinx Virtex Ultrascale+ series device. This board integrates four FMC+ connectors and is compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio). Provided users with a fully functional testing and verification platform. Please contact b2b@mirifica.eu for volume pricing.

Item number VAR-827003207

Manufacturer Product Number: AXVU13F V1.0

Taric/custom code:

Available for immediate dispatch: 0
Dispatch within 2 weeks of order.

Item located in and dispatched from: Riedlingen, Germany

GBP 10,953.12 *
Content 1 piece
Required options:

- Non-cancellable: this condition is implied by law anyway. Confirmed sales order cannot be cancelled by enybody anyway. -- Non-returnable: ”Consumers cannot order this item. Natural persons implicitly declare to order this item for their commercial or professional activity.”

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Product Description

The AXVU13F FPGA development board equipped with the AMD/Xilinx Virtex Ultrascale+ series device, This board integrates 4 x FMC+ connectors, Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), Provided users with a fully functional testing and verification platform


Provide high-speed communication (100G QSFP28+, FMC+) and high-speed storage (SODIMM，M.2) video applications (DP).

Applications

  • ● Computational acceleration

    ● Test and Measurement

  • ● Machine Learning and AI

    ● Emulation and Prototyping

  • ● Network Acceleration

  • ● Wired Communications

  • ● 5G Baseband

  • ● Radar

 

 

Key Features 

AMD Virtex Ultrascale+™ VU13P System

  • AMD Virtex Ultrascale+™ VU13P:
    ◆ 16nm FinFET FPGA fabric
    ◆ Integrated 100G Ethernet MAC and150G Interlaken cores
  • 1 x DDR4 SODIMM Card slot ( Supports up to 32GB DDR4 )
  • 2 x 128 MB QSPI Flash
  • 4 x FMC+

◆FMC+1 has 120 IOs and 20 GTY

◆ FMC+2 has 120 IOs and 16 GTY

◆ FMC+3 has 72 IOs and 16 GTY

◆ FMC+4 has 72 IOs and 16 GTY

  • 1 x 100G QSFP28 (up to 100 Gbps)
  • 1 x Gigabit Ethernet
  • 1 x UART (USB to UART)
  • 8 x 1 x JTAG
  • 2 x SMA (1 x in + 1 x out)
  • 12V single supply
  • Dimensions: 295 x 230 mm form factor

NVIDIA JETSON ORIN NX System

  • NVIDIA Jetson Orin NX Module:
    ◆ Jetson Orin NX 16 GB: Up to 100 TOPs (Need to purchase separately)
    ◆ Jetson Orin NX 8 GB: Up to 70 TOPs (Need to purchase separately)
    (*Jetson Orin NX 16 GB package and Jetson Orin NX 8 GB package are offered separately. Please contact us for more details.
  • Video encoding supports 1 x 4K60 (H.265); 3x 4K30 (H.265); 6x 1080p60 (H.265); 12 x 1080p30 (H.265)
  • Video decoding supports 1 x 8K30 (H.265); 2 x 4K60 (H.265); 4 x 4K30 (H.265); 9x 1080p60 (H.265); 18 x 1080p30 (H.265)
  • 1 x DisplayPort (4K 30Hz/1080P 60Hz video)
  • 1 x NVME M.2 Interface (PCIe Gen 4 x2)
  • 1 x Gigabit Ethernet
  • 1 x M.2 WIFI/BT
  • 1 x Gigabit Ethernet
  • 4 x USB 3.0 Type-A + 1 x USB 3.0 Type-C
Item ID 102752
Condition New
Model AXVU13F V1.0
Manufacturer Alinx Electronic Limited
Manufacturing country China
Content 1 piece
Weight 2000 g
Net weight 1600 g

Board Features

Featuring the AMD/Xilinx Virtex Ultrascale+ XCVU13P-2FHGB2104

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Kintex Ultrascale+ based application.

 
 

What's Inside the Box

ALINX AMD Xilinx Virtex Ultrascale+ XCVU13P FPGA development board and Some accessories

The FAN8060 Heatsink Kit is an optimal cooling solution for FPGA devices – it is low-profile and covers the whole XCVU13P device surface.

 


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