Product Description
The AXW47 development board adopts the Zynq UltraScale+ RFSoC Gen3 series XCZU47DR FPGA chip, integrating RF direct sampling data converters, FPGA logic, a complete ARM processor subsystem, and high-speed transceivers. It supports 8-channel 14-bit RF-ADCs with a maximum sampling rate of 5 GSPS, and 8-channel 14-bit RF-DACs with a maximum sampling rate of 9.85 GSPS. The RF input/output interfaces are designed for frequency bands up to 6 GHz. This provides a comprehensive RF signal chain, maximizing I/O channel density with high bandwidth, heterogeneous processing capabilities, and low power consumption. The carrier board expands an AMD XCKU115 pure-logic FPGA for backend data processing acceleration.
It meets the requirements of applications including 5G wireless infrastructure, cable TV access, test and measurement, satellite communications, phased-array radar/digital array radar, and other high-performance RF scenarios.
Applications
● 5G FR1/FR2 RF and baseband
● phased array system
● Radar System
● Software-Defined Radio
● Medical Imaging Systems
● Spectrum monitoring
Key Features
System-on-Module
● AMD/Xilinx Zynq™ Ultrascale+™ RFSoC Gen3 XCZU47DR-2FFVE1156I:
◆ 930K Logic Cells
◆ 8 x 14 bit 2.5GSPS RF-ADC
◆ 8 x 14 bit 9.85GSPS RF-DAC
◆ ARM® quad-core Cortex™-A53 up to 1.333GHz
◆ ARM® dual-core Cortex™-R5F up to 533MHz
◆ 16nm FinFET+ FPGA fabric
◆ Digital RF-ADC, RF-DAC● Pluggable module with 3x 240pin board-to-board connectors
● 4 GByte (64-bit) DDR4 SDRAM on PS
● 2 GByte (32-bit) DDR4 SDRAM on PL
● 256 MB QSPI Flash
● 32 GByte eMMC Flash on PSBase Board
● AMD/Xilinx Kintex Ultrascale™ XCKU115-2FLVA1517I :
◆ 1,451K Logic Cells
◆ 5,520 DSP Slices
◆ 64 x GTH Transceivers● 2 x 64MB QSPI flash
● 4 x 4 GByte (64-bit) DDR4 SDRAM
● 4 x M.2 Interface
● 2 x MGB Interface
● 2 x 40G QSFP+fiber optic
● 1 x 10G SFP+ fiber optic
● 1 x Gigabit Ethernet
● RF SMBs
◆ 8 x 14bit RF-ADC @ 5.0 GSPS
◆ 8 x 14bit RF-DAC @ 9.85 GSPS● 2 x USB3.0
● 2 x USB&JTAG
● 1 x SD Card
● 4 x LED+8x LED (User defined indicator lights)
● 5 x KEY
● 12V single supply
● Dimensions: 260 x 215 mm form factor
Development Board Features
Featuring the AMD/Xilinx's Zynq™ UltraScale+™ RFSoC XCZU47DR-2FFVE1156I Adaptive SoC
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ RFSoC based application.
* The AXRF47 development board consists of a ACW47 SoM and base board. If you want to purchase ACW47 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.
What's Inside the Box
ALINX AMD Xilinx Zynq™ UltraScale+™ RFSoC ZU47DR development board and Some accessories
Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
| System-on-Module | 1 | Base Board | 1 |
|---|---|---|---|
| Heatsink Kit (preinstalled) | 2 | Network cable | 1 |
| Type-C cable | 1 | The power adapter | 1 |
| Power adapter cable | 1 | SMA cable | 1 |
| Data USB flash drive | 1 | SD card | 1 |
